Study on the Properties of Laser Cutting Refractory Materials

The two-way laser for differential absorption of light detection and ranging will emit a wavelength that resonates with the emblem gas and then emits an almost non-resonant wavelength almost instantaneously, replacing the traditional dual laser device. Two applications of lasers in free-space optical channels: First, when the data flow is dense, the laser switches continuously between two wavelengths to provide a complementary data set, one wavelength is the auxiliary wavelength of the other wavelength; second, when the data When the flow is sparse, the laser becomes an equivalent wavelength division multiplexing device, producing two separate wavelengths of independent data streams.

It is estimated that the market for ceramic devices in the United States is approximately 1 billion U.S. dollars. However, due to the high cost of producing precision components, the market's further growth is limited. At the same time, grinding or diamond grinding is still the most common method of manufacturing ceramic parts. High mechanical strength and fragility often damage and fracture the subsurface layer of the parts being processed. When using diamond tools, the technology accounts for more than 75% of the total cost of processing a ceramic component. One of the reasons is that there are about 1 million US dollars for the diamond grinding machine. Although Laser 1 processing has been studied as an alternative, it may encounter problems with surface roughness requirements. Although the effect of the laser was not significant, some parts exhibited reduced flexural strength after treatment.

The laser heats the material to be cut to more than 1000°C to make the ceramic soft and ductile, and then removes the soft heating layer with a three-dimensional boron nitride cutting tool. In the experiment, the processing of two structural ceramics, namely silicon nitride and locally stable oxidative faults, was investigated. The first material has the typical mechanical properties of a large class of structural ceramics, the latter having a coefficient of thermal expansion similar to that of steel, which makes it suitable for use as a diesel engine component.

Laser-assisted processing equipment produces sheet wafers under machining conditions such as laser beam and laser intensity control, rather than powdered wafers as in the grinding process. Scanning electron microscopy observations show that these wafers are relatively uniform and long and exhibit elastic deformation. The morphology of these wafers is important because it shows that laser-assisted machining differs from the mechanics of grinding to remove materials. Although early studies showed that laser-assisted processing was not very suitable, the life of the processing tool was shortened at elevated temperatures.

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